Quality Products for Metallographic Sample Preparation & Analysis

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Cutting fluids enhances blade performance, extends blade life and minimizes material deformation by reducing heat during cutting.
 
Dressing sticks are used to remove metallic or resin buildup on metal bond and/or plated wafering blades and abrasive grinding discs to restore performance. Silicon carbide (SiC) is for general use on metal plated/bonded diamond products. Aluminum oxide (Al2O3) is recommended for use with resin bonded diamond products/wheels.

 

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Cutting Fluids

Cutting fluid enhances blade performance, extends blade life, and minimizes material deformation by reducing heat during cutting. Use Deli-Cut low speed cutting fluid for gravity-fed saws at full strength. Use Maxi-Cut or Lubri-Cut for speeds above 1,000 RPM (diluted 2-5% with water). Lubri-Cut has low oil content and is easier to clean.

Dressing Stick

Silicon carbide dressing sticks are mostly used to strip metal bond and plated diamond wafering blades of debris that clogs the abraive to restore peformance.

Aluminum oxide dressing sticks are used to strip resin bond abrasive products of debris that sticks to and clogs the abrasive during normal use to restore performance and efficiency.