Resins
Cold/casting resins are are available in different forms, epoxy, acrylic and light curing. Cold mounting is ideal for encapsulating porous or delicate samples which involves pouring a resin into a mold cup that produces the form to be held for preparation.
Hot/compression resins are available in different types, phenolic, epoxy, diallyl phthalate, acrylic and conductive (EM). Generally these are the most economical choice to meet the demands of high volume mounting environments for samples that can withstand the compression and heat from the mounting process.
Cold / Casting
Acrylic resin is the common choice when a short cure time is necessary to meet the demands of high volume mounting. They are generally preferred for mounting PCB coupons for microsectioning.
Epoxy resins typically chosen for R&D and failure analysis for improved penetration into complex structures, for chemical resistance and stability in an electron microscope due to low offgassing properties.
EpoRed is a predyed EpoxySet resin for use only with EpoxySet hardener. Large kits typically will produce approximately 200 x 1.25-inch/32 mm mounts.
Use the drop-down filter to find either epoxy or acrylic cold/casting products.
Technical data and detailed information can be found in the overview below.
Note: Shipping restrictions apply as these are considered "DG" by IATA and US DOT, additional charges may apply/be incurred.
Hot / Compression
Hot/Compression mounting is an economical method of encapsulating samples that can withstand the pressure and heat of the mounting process. A variety of mounting powders and preforms are available. All powders include a measuring scoop.
Use the drop down filters to narrow the product selection.
Refer to the table at the bottom/end of the page for specifications and comparison of products.
