As the name suggests, this solution is used to dissolve and remove cured epoxy to salvage or extract the sample.
Refer to the product guide and SDS for further information on chemistry and use.
Borosilicate glass is an ideal material for mounting due to its resistance to the effects of extreme thermal exposure when melting wax at temps up to 150 °C. It is also resistant to most chemicals and chemicals used for dissolving wax, such as acetone.
These mixing cups are suitable for mixing epoxy and acrylic resins and feature a graduated scale to help with precise volumetric measurements.
Wood sticks are convenient for stirring resins in the mixing cups.
Mold release creates a buffer on mold surfaces that inhibits adhesion between the cured resin and mold. In hot mounting, effective application helps cured resins slide from the mold and reduces flashing/build up of resin. In cold mounting, the mold release adheres to the resin and slides with it when the cured resin sample is removed from the mold cup, which produces a cloudy finish.
Allied offers these products in seveal forms to choose from:
2-part cups consist of a body and removable bottom cap that snaps into place and is removed to slide out and separate the cured mold from the cup. Only metric (mm) size cups are UV/light transparent and compatible for use with "light" curing resin.
Silicone rubber mold cups are compatible with all resins and generally used for curing larger molds for larger samples. These thick-walled molds absorb the higher heat produced by large mass curing. Mold release is recommended.
These tight tolerance, precision ground steel pins are used to align and "gang" mount PCB coupons so that all through holes are on a common plane prior to mounting/encapsulation.