Grinding
There are several forms and types of diamond grinding abrasives in disc and tool form each engineered for specific needs/applications.
Diamond grinding discs are used as an alternative to bonded diamond tools for thinning silicon where higher throughput is desired on large die/substrates. The thick film substrate provides high durability and long life and are secured to grinding/polishing mounts using either LocTite® 460 or 454®.
Diamond tools are available in either plated or bonded forms and used for grinding smaller, more precise geometric applications/requirements.
Mounts are used for grinding and polishing, where discs are secured to the flat ends using instant adhesive.
Diamond Discs
Diamond grinding discs are ideal for grinding/thinning silicon, glass and ceramic. Diameter selection depends on corner radius and restrictions of sample.
These diamond abrasive discs feature a durable film backing that are meant to be secured to mounts using a high performance adhesive.
Diamond Tools
Bonded: Recommended for grinding non-metals such as mold compound, silicon, glass, and ceramic. Compared with plated tools, they are made with finer diamonds bound in a metal matrix that provides longer life and maintains better shape/profile, higher accuracy and finer surface finish.
Coarse: Recommended for ceramics.
Medium: Recommended for ceramics.
Fine: Recommended for mold compound, ceramic and bulk silicon.
Very Fine: Recommended for silicon.
Diamond Plated Tools: Suitable for bulk removal of plastic/composite materials and other non-metallic materials including glass and ceramic.
