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Milling - X-Prep®

Used primarily to support electrical and physical failure analysis of electronic devices across a range of industries including semiconductor manufacturing, automotive, space electronics and/or cyber/forensics, precision milling offers a unique solution that includes equipment and consumables for cutting, grinding and polishing borrowed from expertise in sample preparation. 

  

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X-Prep Accessories

Write condensed paragraph about accessories.

See OVERVIEW tab below for individual item information.

X-Prep®

The X-Prep® is a specialized 5-axis CNC-based milling/grinding/polishing machine designed to support electrical and physical failure analysis techniques and other applications requiring high precision sample preparation.

It features a wizard-based, user-friendly, intuitive interface that guides the operator through a screen sequence.  As each screen appears, instruction is provided to the operator, ensuring every parameter and function is defined before operation.  Help  buttons on each screen provide access to additional explanation and instruction.  

A high-definition (720p) color camera projects a magnified, razor-sharp image of the sample onto the touch screen to help the operator define the X/Y milling/grinding/polishing boundary.  

Automatic tilt adjustment levels the sample plane parallel to the X/Y plane of the cutting tool.  Unevenly mounted or tilted samples can easily be leveled using this functionality.

A variety of fixtures and accessories are available to accommodate various sample types and sizes.The X-Prep® is a specialized 5-axis CNC-based milling/grinding/polishing machine designed to support electrical and physical failure analysis techniques and other applications requiring high precision sample preparation.

It features a wizard-based, user-friendly, intuitive interface that guides the operator through a screen sequence.  As each screen appears, instruction is provided to the operator, ensuring every parameter and function is defined before operation.  Help  buttons on each screen provide access to additional explanation and instruction.  

A high-definition (720p) color camera projects a magnified, razor-sharp image of the sample onto the touch screen to help the operator define the X/Y milling/grinding/polishing boundary.  

Automatic tilt adjustment levels the sample plane parallel to the X/Y plane of the cutting tool.  Unevenly mounted or tilted samples can easily be leveled using this functionality.

A variety of fixtures and accessories are available to accommodate various sample types and sizes.

X-Prep® Vision™

The X-Prep® Vision™ is a metrology tool that enables measurement of silicon and semitransparent substrates. It is necessary for applications that require uniform thinning to a specific target with a tolerance of +/- 3 µm or better.

The X-Prep® fixture adapter is also secured to the motorized stage on the X-Prep® Vision™, ensuring the measurement/tool control coordinates remain aligned when transferred between systems. 

A library with over 130 materials (i.e., GaAs, InGaAs, SiC, Sapphire/Al2O3, InP, SiGe, GaN, photo-resist) is included with every system.

Meaurement & Observation - How it Works

IR light is focused onto a sample, and a unique signal based on the refractive index of the material is created. The return signal is analyzed by the software to produce a thickness value.

Measuring Below 10 µm Thickness

For applications requiring thinning to less than 10 µm, precise measurement is possible only by adding the visible light spectrometer accessory.