Personal menu

Discs

Standard Diamond Lapping Film consists of precision graded diamond particles resin bonded to a uniform mylar film. They provide excellent edge retention and maintain coplanarity regardless of varying materials or hardness within the sample. Typically used for unencapsulated cross-sectioning, TEM wedge/plan-view polishing, backside polishing and FIB sample thinning.

NOTE: Quantity discount pricing is available for this product. Ordering quantities of 5-9 packs and 10+ packs will automatically trigger a discount in the shopping cart.

Use the drop-down menus to refine your product search.

Availability:

Item Number: Lapping Film Discs

Mineral Attribute of Mineral
Diameter Attribute of Diameter
Backing Attribute of Backing

Overview
Safety Data Sheet
Video
Contact Us

	Aluminum Oxide Lapping film consists of a mylar polishing film coated with resin containing aluminum oxide particles. It is recommended for fine grinding and lapping applications where edge retention is important. Polishing film is for use with either encapsulated or unencapsulated samples but are not recommended for power head applications. Features: * Micron graded premium abrasives to produce precise finishes in grades 30 to 0.05 micron * Precision backing for uniformity and sample planarity * Resists water, oil and most solvents * Color-coded for quick identification * Use for encapsulated or non-encapsulated samples * Not recommended for power head applications Recommended for ferrous metals and glass.
	Diamond is recommended for all hard, brittle non-metals and refractory materials. Standard Diamond Lapping Film consists of precision graded diamond particles resin bonded to a uniform mylar film. They provide excellent edge retention and maintain coplanarity regardless of varying materials or hardness within the sample. Typically used for unencapsulated cross-sectioning, TEM wedge/plan-view polishing, backside polishing and FIB sample thinning.
	Silicon Carbide and Silicon Dioxide lapping films consists of a mylar film coated with resin containing either silicon carbide or silicon dioxide particles. They are recommended for fine grinding and lapping applications where edge retention is important. Features: * Micron graded premium abrasives to produce precise finishes in grades 30 to 1 micron * Precision backing for uniformity and sample planarity * Resists water, oil and most solvents * Color-coded for quick identification * Use for encapsulated or non-encapsulated samples * Not recommended for power head applications Silicon Carbide: recommended for non-ferrous metals and polymers. Silicon Dioxide: recommended as an alternative to colloidals and cloths for final polish on SEM and TEM samples.
	Cerium Oxide is generally recommended for polishing glass and optical components.

Aluminum Oxide Lapping Film	Silicon Carbide Lapping Film
Cerium Oxide Lapping Film	Silicon Dioxide Lapping Film
Diamond Lapping Film

Send us a message

Your name *

Your email *

Subject: *

Enquiry *

	Aluminum Oxide Lapping film consists of a mylar polishing film coated with resin containing aluminum oxide particles. It is recommended for fine grinding and lapping applications where edge retention is important. Polishing film is for use with either encapsulated or unencapsulated samples but are not recommended for power head applications. Features: * Micron graded premium abrasives to produce precise finishes in grades 30 to 0.05 micron * Precision backing for uniformity and sample planarity * Resists water, oil and most solvents * Color-coded for quick identification * Use for encapsulated or non-encapsulated samples * Not recommended for power head applications Recommended for ferrous metals and glass.
	Diamond is recommended for all hard, brittle non-metals and refractory materials. Standard Diamond Lapping Film consists of precision graded diamond particles resin bonded to a uniform mylar film. They provide excellent edge retention and maintain coplanarity regardless of varying materials or hardness within the sample. Typically used for unencapsulated cross-sectioning, TEM wedge/plan-view polishing, backside polishing and FIB sample thinning.
	Silicon Carbide and Silicon Dioxide lapping films consists of a mylar film coated with resin containing either silicon carbide or silicon dioxide particles. They are recommended for fine grinding and lapping applications where edge retention is important. Features: * Micron graded premium abrasives to produce precise finishes in grades 30 to 1 micron * Precision backing for uniformity and sample planarity * Resists water, oil and most solvents * Color-coded for quick identification * Use for encapsulated or non-encapsulated samples * Not recommended for power head applications Silicon Carbide: recommended for non-ferrous metals and polymers. Silicon Dioxide: recommended as an alternative to colloidals and cloths for final polish on SEM and TEM samples.
	Cerium Oxide is generally recommended for polishing glass and optical components.

Product tags

(1939)

Available Options

Discs

Discs

SUPPORT

EQUIPMENT

CONSUMABLES

ABOUT US

INDUSTRIES

EMAIL SIGN UP