Resins

Hot/Compression mounting is an economical method of encapsulating samples that can withstand the pressure and heat of the mounting process. A variety of mounting powders are available and include a measuring scoop.

Phenolic: Black, green and red phenolic powders are used for routine applications, when color coding for material identification, or as backfill for more expensive powders.

Epoxy, Glass-Filled: This powder provides excellent adhesion, chemical resistance and edge retention. It also offers very good flow characteristics for mounting samples with complex shape/geometry. The glass filler increases its hardness, and is recommended for mounting medium-hard to hard materials. A mold release product is required.

Blue Diallyl Phalate: This powder provides high hardness, excellent edge retention and chemical resistance for mounting extremely hard materials.

Thermoplastic: This acrylic powder cures transparent, making it suitable for site-specific sample preparation when there is a need to see the approaching target.

Conductive: These powders are used to make conductive samples for scanning electron microscopy and electrolytic polishing. The copper-based powder should be used when analyzing samples where copper is not a primary constituent. The graphite-based powder is recommended for specimens without carbon as a component.

Cold mounting is recommended when encapsulating samples that cannot withstand the heat and pressure of compression mounting, when better flow and penetration of the mounting resin is needed, or when a large quantity of samples must be encapsulated at once.

Acrylics: Typically used for their rapid cure times, or when large volume sample throughput is needed.

QuickCure: When cured under pressure (>20 psi), it produces a clear, bubblefree mount. The longer cure time (15–20 min.) allows improved flow and penetration.

QuickSet: Used to encapsulate a wide variety of specimens, especially PCB coupons and other electronic components. Its rapid, 6–8 minute cure time is ideal for high-volume applications. Pressurization can help to minimize bubbles for improved clarity

Epoxies: Typically used for excellent flow and penetration, or when better adhesion, chemical resistance, less shrinkage and clarity are required.

EpoxySet: With very low viscosity, EpoxySet offers excellent flow and penetration. It is extremely hard, crystal clear and exhibits firm adhesion with virtually no shrinkage. Its low curing temperature is ideal for heat sensitive samples.

EpoxyMount: This fast-curing epoxy hardens in 2 hours at room temperature while still maintaining quality characteristics such as good adhesion, hardness and minimal shrinkage.

Note: Shipping restrictions apply to some of these products and are considered "DG" by IATA and US DOT, additional charges may apply/be incurred.