The VacuPrep™ removes trapped air from uncured epoxy, filling open pores and cavities in samples to provide maximum bonding and support. This maintains sample integrity during abrasive preparation, reducing the chance of cracking or delamination.
The VacuPrep™ comes in two (2) versions - the standard model and a turntable model. This new variant adds a turntable with an anti-stick PTFE lined interior that operates with a rotation wheel located on the exterior right side of the unit. The turntable features markings where cups can be positioned beneath the fill tube in the cover. The operator then rotates the wheel on the right side of the unit to position each cup for drawing epoxy from the mixing cup while under vacuum.
The PC-200™ is a large volume pressure chamber for cold mounting with acrylic and epoxy. With an 8" opening and 7.5" depth, this pressure chamber accommodates oversized silicone mounting cups, a large quantity of round cups, or multiple PCB molds.
The process of loading the PC-200™ pressure chamber with freshly poured molds is made easier with the stacking tray. The diameter of the tray easily fits into the chamber opening. The bottom of the tray is Teflon® for easy cleanup of spilled mold resin (acrylic or epoxy). The design allows for stable stacking of three (3) trays into the PC-200.
The BL-100 is a light chamber used for curing BL-Cure and UV-curing resins. When the sliding drawer is pulled out/open, the square glass platform measures 5 x 5 inches (125 x 125 mm) and molds up to 2.5-inches (63 mm) can fit inside.
It is supplied with a set of bulbs (OSRAM 9W/71-G23) and a country specific power cord.
The compact design measures 10.8" x 9.2" x 6" (270 x 240 x 170 mm) and weighs 6.5 lbs. (~3 kg).
This new product is designed to help extract/demold cured resin mounts from various 2-part mold cups. It features a large, stable base with a linear slide mechanism that is operated by hand to easily push the cured resin mold from the mounting cup. Mount Extraction Press for PCB Mold Cups is also available.