Accessories
Dressing sticks are used to remove metallic or resin buildup on metal bond and/or plated wafering blades and Dia-Grid grinding discs to restore performance. Silicon carbide (SiC) is for general use on metal plated/bonded diamond products. Aluminum oxide (Al2O3) is recommended for use with resin bonded diamond products.
Cutting fluids enhance blade performance, extend blade life and minimize material deformation by reducing heat during sectioning.
Dressing Stick
Silicon carbide - These sticks are used to remove accumulated material from plated and metal bonded blades.
Aluminum Oxide - Used to remove accumulated material from the diamond segments to restore grinding performance.
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Cutting Fluids
Cutting fluid enhances blade performance, extends blade life and minimizes material deformation by reducing heat during sectioning. Use Deli-Cut low speed cutting fluid for gravity-fed saws at full strength. Use Maxi-Cut or Lubri-Cut for speeds above 1,000 RPM, diluted 2-5% with water. Lubri-Cut has a low oil content and is easier to clean.
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