Grinding

These durable, film-backed diamond abrasive discs are used as an alternative to bonded diamond tools for high MRR - material removal rates. Available in different grades from coarse to very fine, color coding helps with visual identification, each has its own effective range of material removal indicated on this page below the table. 

Discs are secured to mounts using a high-performance adhesive like LOCTITE® 460™ or 454™, and peel off easily when worn. 

Bonded diamond tools are used for high precision grinding of a variety of materials, including silicon, sapphire, SiC and other non-metal alloys. They feature a beveled tip geometry to facilitate grinding which can be quickly reshaped to extend tool life.

• Metal bond for general use and long life
• Resin bond for brittle materials (SiC) and improved finish

Plated diamond tools are available in a fine and coarse grade and are used for higher removal rate than bonded diamond tools and result in a rougher finish that may require cleanup operations using a bonded tool before polishing. They are an excellent choice for rapid removal of high glass content FR4 substrates.

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