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Alumina suspensions are de-agglomerated and water based. Chemically stable, the pre-mixed formulas are a clean, convenient alternative to powders and are ideal for the finest finishes. |
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Cerium oxide suspension is primarily used for polishing glass and optical materials. It also works well for polishing lead, solder and other soft materials. |
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Colloidal alumina suspensions arr acidic alumina suspensions with a pH of 3.5 used to final polish ferrous metals and ceramics. These non-clogging formulas flow easily through fluid dispensing systems, and can be diluted with DI water up to 3:1. |
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Colloidal silica suspension, non-stick formula is an excellent final polishing suspension for most materials, this proprietary formula features a pH of 10 and rinses easily from samples and equipment, even after it dries. It is slow drying, making it an ideal choice for prolonged polishing requirements such as those for EBSD. The pH may be modified with chemical solutions to improve microstructural contrast. |
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Colloidal silica suspension, water-free formula is ideal as a final polishing solution for water sensitive materials such as zinc, magnesium, lithium to name a few. It is also useful for prolonged polishing commonly used for preparing samples for EBSD analysis. It is recommended to use this product with polishing pads made of materials that can withstand prolonged exposure to the chemical elements of this solution, such as Chem-Pol and Final A. |
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Colloidal silica suspension is used for final polishing, colloidal suspensions are mixtures of abrasive particles dispersed throughout a chemically aggressive liquid carrier. This combination provides a chemical-mechanical polishing action, resulting in deformation-free surfaces. The modified pH of these suspensions can provide delineation of grain boundaries and other microstructural features for some sample types.
The 0.02 micron colloidal silica formula provides ultra-fine surface finishes for demanding SEM/TEM analysis. It is non-crystallizing and has a 9.8 pH.
The 0.05 micron colloidal silica formula is an excellent final polish for a wide variety of materials, especially non-ferrous metals, PCBs and ICs. It is non-crystallizing and has a 9.8 pH. |
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Colloidal silica/Alumina solution is a unique mixture of colloidal silica and alumina with a pH of 8.5. The addition of gamma alumina allows improved mechanical polishing when compared to colloidal silica alone. Used to final polish both ferrous and non-ferrous metals, metal-matrix composites and various non-metallic materials. |
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FinalPrep Alumina Polishing solution is a de-agglomerated, polycrystalline alumina solution excellent for final polishing applications for nearly any material. With a pH of 9 to 9.5, the basic chemical element enhances microstructural features. It works exceptionally well for polishing soft, ductile, or precious metals, such as gold (Au) and silver (Ag). |
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OpTech Polishing slurry is composed of silica/alumina/diamond abrasives and provides an excellent finish on materials such as glass, fiber optics, quartz, sapphire and ceramics. |
