The X-Prep® is a specialized 5-axis CNC-based milling/grinding/polishing machine designed to support electrical and physical failure analysis techniques and other applications requiring high precision sample preparation.

It features a wizard-based, user-friendly, intuitive interface that guides the operator through a screen sequence.  As each screen appears, instruction is provided to the operator, ensuring every parameter and function is defined before operation. Help buttons on each screen provide access to additional explanation and instruction.  

A high-definition (720p) color camera projects a magnified, razor-sharp image of the sample onto the touch screen to help the operator define the X/Y milling/grinding/polishing boundary.  

Automatic tilt adjustment levels the sample plane parallel to the X/Y plane of the cutting tool.  Unevenly mounted or tilted samples can easily be leveled using this functionality.

A variety of fixtures and accessories are available to accommodate various sample types and sizes. The X-Prep® is a specialized 5-axis CNC-based milling/grinding/polishing machine designed to support electrical and physical failure analysis techniques and other applications requiring high precision sample preparation.

Precision, borosilicate glass carriers/inserts for use with X-Prep® fixtures come in a variety of sizes.

X-Lube™ is a solvent-free lubricant that helps maintain a cooler cutting temperature, traps cutting debris and reduces tool wear. It is also used with diamond compound for polishing operations.

These 2-part, low viscosity epoxy resins are engineered for specialized bonding applications, featuring excellent adhesion, chemical resistance and thermal/electrical resistance.

EpoxyBond 110™, is rapid curing and heat-activated, ideal in applications where a thin bond line is desired. It has a high transition temperature and extraordinary resistance to post cure, high heat exposure.

EpoxyBond 14™, is clear, colorless and cures very hard either at 65° C in 1 hour or in 24 hours at room temperature. It is ideal for filling small cavities (pocket, underfill) and for glass slide bonding.

M-Bond 610, is excellent for adhering multiple samples for TEM dimpling and bonding of post-polished samples to grids for TEM and FIB observation. It is chemically resistant and provides a very thin glue line that ion mills evenly.

LOCTITES: These high purity adhesives cure rapidly without heat. LOCTITE® 460™ is a low-viscosity liquid and LOCTITE® 454™ is a gel for more controlled application.

Mounting Wax, is a clear wax provides a quick and strong bond between samples and fixtures for cutting and/or polishing. It melts at 49° C (120° F) and is soluble in acetone. Sheet wax provides uniform distribution of wax to improve registration accuracy of the sample to the fixture (i.e., dicing applications). It flows at 100° C (212° F) and is soluble in sheet wax dissolver.