Clear wax provides high strength bonding of samples to fixtures. With a melting temperature of 165 ºF (74 ºC), in round form, this product is easy to apply, melting directly onto heated fixtures and is soluble in acetone.
	Sheet wax is comparably softer than clear wax and chosen for applications requiring improved uniformity. Provided on a release paper, it is often cut to size, then applied to the cool mounting surface prior to heating sample/object. This product is typically common for bonding wafers and/or glass substrates for docing and/or thinning applicaitons.
	LocTite® 460™ and 454™ are high purity, cyanoacrylate, instant adhesives. Both soluble in acetone, they offer very reliable strength and performance.
	EpoxyBond 110™, EpoxyBond 14™ and M-Bond 610 are 2-part, low viscosity, epoxy resins engineered for specialized bonding applications, featuring very high adhesion, exceptionally high chemical resistance and offer excellent thermally and electrical resistance.
	EpoxyBond 110™ is a rapid curing, heat-activated resin ideal in applications where a thin bond line and very high adhesion is desired. It has a high Tg  and extraordinary resistance to post cure, high heat exposure.
	EpoxyBond 14™ is a clear, colorless resin that cures very hard either @ 65°C in 1-hour or in 24h @ room temperature (RT) and is ideal for filling small cavities (pocket, underfill) and for glass slide bonding of petrographic samples for geology.
	Wax Dissolver is used to remove sheet mounting wax residue from the sample.

EpoxyBond 110™, EpoxyBond 14™ and M-Bond 610 are 2-part, low viscosity, epoxy resins engineered for specialized bonding applications, featuring very high adhesion, exceptionally high chemical resistance and offer excellent thermally and electrical resistance. EpoxyBond 110™ is a rapid curing, heat-activated resin ideal in applications where a thin bond line and very high adhesion is desired. It has a high T_g  and extraordinary resistance to post cure, high heat exposure. EpoxyBond 14™ is a clear, colorless resin that cures very hard either @ 65°C in 1-hour or in 24h @ room temperature (RT) and is ideal for filling small cavities (pocket, underfill) and for glass slide bonding of petrographic samples for geology.

Waxes are used to secure samples to fixtures. Clear wax provides high strength bonding of samples to fixtures. With a melting temperature of 165 ºF (74 ºC), in round form, this product is easy to apply, melting directly onto heated fixtures and is soluble in acetone. Sheet wax is comparably softer than clear wax and chosen for applications requiring improved uniformity. Provided on a release paper, it is often cut to size, then applied to the cool mounting surface prior to heating sample/object. This product is typically common for bonding wafers and/or glass substrates for docing and/or thinning applicaitons.

LocTite® 460™ and 454™ are high purity, cyanoacrylate, instant adhesives. Both soluble in acetone, they offer very reliable strength and performance.