Quality Products for Metallographic Sample Preparation & Analysis

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Products tagged with 'semiconductor'

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VacuPrep™

The VacuPrep™ removes trapped air from uncured epoxy, filling open pores and cavities in samples to provide maximum bonding and support. This maintains sample integrity during abrasive preparation, reducing the chance of cracking or delamination.

The VacuPrep™ comes in two (2) versions - the standard model and a turntable model.   This new variant adds a turntable with an anti-stick PTFE lined interior that operates with a rotation wheel located on the exterior right side of the unit. The turntable features markings where cups can be positioned beneath the fill tube in the cover. The operator then rotates the wheel on the right side of the unit to position each cup for drawing epoxy from the mixing cup while under vacuum.

X-Prep®

The X-Prep® is a specialized 5-axis CNC-based milling/grinding/polishing machine designed to support electrical and physical failure analysis techniques and other applications requiring high precision sample preparation.

It features a wizard-based, user-friendly, intuitive interface that guides the operator through a screen sequence.  As each screen appears, instruction is provided to the operator, ensuring every parameter and function is defined before operation. Help buttons on each screen provide access to additional explanation and instruction.  

A high-definition (720p) color camera projects a magnified, razor-sharp image of the sample onto the touch screen to help the operator define the X/Y milling/grinding/polishing boundary.  

Automatic tilt adjustment levels the sample plane parallel to the X/Y plane of the cutting tool.  Unevenly mounted or tilted samples can easily be leveled using this functionality.

A variety of fixtures and accessories are available to accommodate various sample types and sizes. The X-Prep® is a specialized 5-axis CNC-based milling/grinding/polishing machine designed to support electrical and physical failure analysis techniques and other applications requiring high precision sample preparation.

MultiPrep™

The MultiPrep™ System enables precise semiautomatic sample preparation of a wide range of materials for microscopic (optical, SEM, FIB, TEM, AFM, etc.) evaluation. 

Capabilities include parallel polishing, angle polishing, site-specific polishing or any combination thereof. It provides reproducible results by eliminating inconsistencies between users, regardless of their skill. 

Dual micrometers (pitch and roll) allow precise sample tilt adjustments relative to the abrasive plane. A rigid Z-indexing spindle maintains the predefined geometric orientation throughout the grinding/polishing process. Digital indicators enable quantifiable material removal, which can be monitored real-time (front), or preset (rear) for unattended operation. Variable speed rotation and oscillation maximize use of the entire grinding/polishing disc and minimize artifacts. Adjustable load control expands its capability to handle a range of small (delicate) to large samples.

CMP Wafer Lapping Fixtures

These central force sample holders are designed for polishing wafers using a semi-automatic grinder/polisher.

They feature an outer, spring-loaded compression ring that holds the wafer in place, but also conditions and compresses the pad for maximum flatness and minimal edge rounding. 

Wafers are held in place using water or a preferential light grease.  

OptiPrep™

The OptiPrep™ System is designed for production polishing of a wide variety of optical components including Ferrules, Connectors, Waveguides, Silicon V-groove, Optical Chips, Capillary/Glass Lenses, Fiber Bundles, Ribbon Fiber and Bare Fiber

Optical polishing applications rely on specific geometry. The OptiPrep™ features a fixed cam-lock interface reference that is parallel to the plane of the platen. Desired sample angles are obtained based on geometric orientation built into the fixture.

Z-positioning/indexing is displayed on the digital indicator with 1-micron resolution and can be pre-set for unattended operation. Variable speed rotation/limit rotation and oscillation with variable sweep maximize use of the entire abrasive surface.

Adjustable load control expands its capability to handle a range of small (delicate) to large samples.

Applications where the OptiPrep™ is used often require custom fixtures. Please contact Allied for assistance with a current fixture or to design and manufacture a fixture for a complete solution.