Each fixture is designed to accommodate a carrier insert onto which samples are mounted using wax. Wax offers an advantage over clamping when dealing with delicate samples, or for those so small that clamping is not an option. All fixtures allow the sample to be submerged in lubricant to maintain lower temperatures for improved tool life and sample preservation as well as capturing particulates from becoming airborne.

2-part cups are reusable and have a separate bottom allowing easy mount removal after curing. Metric size cups are transparent, and compatible with UV light curing resins.

Silicone mold cups are compatible with epoxy or acrylic mounting resins. These reusable cups are available in a range of variable shapes to accommodate larger samples and are 1” deep with thick walls for maximum durability, shape retention and heat dissipation.

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Indexing pins are used to align through-holes when encapsulating multiple printed circuit board coupons in one mount.

These 2-part, low viscosity epoxy resins are engineered for specialized bonding applications, featuring excellent adhesion, chemical resistance and thermal/electrical resistance.

EpoxyBond 110™, is rapid curing and heat-activated, ideal in applications where a thin bond line is desired. It has a high transition temperature and extraordinary resistance to post cure, high heat exposure.

EpoxyBond 14™, is clear, colorless and cures very hard either at 65° C in 1 hour or in 24 hours at room temperature. It is ideal for filling small cavities (pocket, underfill) and for glass slide bonding.

M-Bond 610, is excellent for adhering multiple samples for TEM dimpling and bonding of post-polished samples to grids for TEM and FIB observation. It is chemically resistant and provides a very thin glue line that ion mills evenly.

LOCTITES: These high purity adhesives cure rapidly without heat. LOCTITE® 460™ is a low-viscosity liquid and LOCTITE® 454™ is a gel for more controlled application.

Mounting Wax, is a clear wax provides a quick and strong bond between samples and fixtures for cutting and/or polishing. It melts at 49° C (120° F) and is soluble in acetone. Sheet wax provides uniform distribution of wax to improve registration accuracy of the sample to the fixture (i.e., dicing applications). It flows at 100° C (212° F) and is soluble in sheet wax dissolver.