Epoxy

Epoxy resins offer superior adhesion, feature low viscosity, allowing it to penetrate porous and open structures and offers superior chemical resistance. They consist of a resin and hardener that are measured by weight, then thoroughly mixed to produce a homogeneous mixture before pouring into a mold cup. Once poured, they can be subjected to vacuum (~ 20-25 mm Hg/2.6 - 3.3 kPa) help draw it into porous, open structures and remove any air bubbles, then left to cure at room (~ 25 °C) temperature. Epoxy resins are compatible with most all mold cups and a mold release is recommended to make it easy to extract the cured/hardened mold from the cup.
EpoxySet - Curing in 8-hours at room temperature, this extremely low viscosity resin (300 cP) is crystal-clear (ref. index 1.51) offering superior adhesion and hardness (89 shore D) with a low exothermic temperature of 54 °C/130 °F. Resin/hardener weight mixing ratio - 100:12.
EpoxyMount - Curing in 2-hours @ room temperature, this clear resin offers excellent hardness (87 shore D) and clarity (ref. index 1.51) with a peak exothermic temperature of 66 °C/150 °F. Resin/hardener weight mixing ratio - 10:3.
EpoRed - A red-dyed resin for use with EpoxySet hardener, this produce produces a red tinted translucent mount that offers contrast in darkfield illumination in an optical microscope.

No products were found that matched your criteria.