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Quality Products for Metallographic Sample Preparation & Analysis

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  • CMP Wafer Lapping Fixtures

CMP Wafer Lapping Fixtures

Parent Grinding Polishing CMP Wafer Lapping Fixtures.jpg

CMP Wafer Lapping Fixtures

These central force sample holders are designed for polishing wafers using a semi-automatic grinder/polisher.

They feature an outer, spring-loaded compression ring that holds the wafer in place, but also conditions and compresses the pad for maximum flatness and minimal edge rounding. 

Wafers are held in place using water or a preferential light grease.  

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Item Number: CMP Wafer Lapping Fixtures
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These central force sample holders are designed for polishing wafers using a semi-automatic grinder/polisher.

They feature an outer, spring-loaded compression ring that holds the wafer in place, but also conditions and compresses the pad for maximum flatness and minimal edge rounding.

Wafers are held in place using water or a preferential light grease.

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These central force sample holders are designed for polishing wafers using a semi-automatic grinder/polisher.

They feature an outer, spring-loaded compression ring that holds the wafer in place, but also conditions and compresses the pad for maximum flatness and minimal edge rounding.

Wafers are held in place using water or a preferential light grease.

Product tags
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  • cmp polishing (1)
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  • mechanical and chemical polishing (1)
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The MetPrep 3x™ grinding and polishing machines, with the PH™ line of power heads, are powerful systems for semiautomatic operation, ideal for low to high volume sample preparation requirements. Two combinations provide ideal solutions that accommodate any lab, application or material.

The microprocessor-based system allows the operator to use either the manual Input Mode to enter parameters throughout a procedure, or the user-defined preprogrammed Steps and Sequences Mode to select steps in a sequence as the procedure advances.

The PH-3™ power head offers maximum versatility for low to high volume semi-automatic sample preparation, using either central or individual sample force modes. The pneumatic-electric systems provide controlled sample force and allow up to nine (9) samples to be prepared simultaneously in central force and three (3) samples in individual force. The unique tilt-up design allows easy, unhindered access to the sample holder and platen, and eliminates the need to reposition the head during the preparation procedure.

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Parent Grinding Polishing Semi Automatic MetPrep 3x PH-4.jpg

MetPrep 3x™ & PH-4™

The MetPrep 3x™ grinding and polishing machines, with PH™ power heads, are powerful systems for semiautomatic operation, ideal for low to high volume sample preparation requirements. Two combinations provide ideal solutions that accommodate any lab, application or material. The microprocessor-based system allows the operator to use either the manual Input Mode to enter parameters throughout a procedure, or the user-defined preprogrammed Steps and Sequences Mode to select steps in a sequence as the procedure advances.

Either standard or magnetic 8"/203 mm or 10"/254 mm platens may be used with any adhesive, non-adhesive or magnetic system disc.

The PH-4™ power head offers maximum versatility for low to high volume semi-automatic sample preparation, using either central or individual sample force modes. The pneumatic-electric systems provide controlled sample force and allow up to nine (9) samples to be prepared simultaneously in central force and four (4) samples in individual force. The unique tilt-up design allows easy, unhindered access to the sample holder and platen, and eliminates the need to reposition the head during the preparation procedure.

Please register or login to obtain a quote
Parent Grinding Polishing Semi Automatic MetPrep 4x PH4.jpg

MetPrep 4x™ & PH-4™

The MetPrep 4x™ grinding and polishing machines, with the PH™ line of power heads, are powerful systems for semiautomatic operation, ideal for low to high volume sample preparation requirements. Two combinations provide ideal solutions that accommodate any lab, application or material.

The microprocessor-based system allows the operator to use either the manual Input Mode to enter parameters throughout a procedure, or the user-defined preprogrammed Steps and Sequences Mode to select steps in a sequence as the procedure advances.

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Either standard or magnetic platens may be used with any plain/adhesive backed or magnetic system disc.

Please register or login to obtain a quote
Parent Grinding Polishing Semi Automatic MetPrep  4x PH6.jpg

MetPrep 4x™ & PH-6™

The MetPrep 4x™ grinding and polishing machines, with PH™ power heads, are powerful systems for semiautomatic operation, ideal for low to high volume sample preparation requirements. Two combinations provide ideal solutions that accommodate any lab, application or material. The microprocessor-based system allows the operator to use either the manual Input Mode to enter parameters throughout a procedure, or the user-defined preprogrammed Steps and Sequences Mode to select steps in a sequence as the procedure advances.

Either standard or magnetic 10"/254 mm or 12"/305 mm platens may be used with any adhesive, non-adhesive or magnetic system disc.

Please register or login to obtain a quote
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