Products tagged with 'tem'

The MultiPrep™ System enables precise semiautomatic sample preparation of a wide range of materials for microscopic (optical, SEM, FIB, TEM, AFM, etc.) evaluation. 

Capabilities include parallel polishing, angle polishing, site-specific polishing or any combination thereof. It provides reproducible results by eliminating inconsistencies between users, regardless of their skill. 

Dual micrometers (pitch and roll) allow precise sample tilt adjustments relative to the abrasive plane. A rigid Z-indexing spindle maintains the predefined geometric orientation throughout the grinding/polishing process. Digital indicators enable quantifiable material removal, which can be monitored real-time (front), or preset (rear) for unattended operation. Variable speed rotation and oscillation maximize use of the entire grinding/polishing disc and minimize artifacts. Adjustable load control expands its capability to handle a range of small (delicate) to large samples.

The TEM Wedge Tool is used to thin materials to electron transparency for TEM observation. The rear micrometer heads allow radial or axial (wedge) angle adjustments in the sample. Non-rotating micrometer heads are available to eliminate faceting of Delrin® feet.

The Cross-Sectioning Tool is used to cross-section small, unencapsulated samples such as IC's and other electronic devices.