Products tagged with 'x-prep rapid removal'

Bonded diamond tools are used for high precision grinding of a variety of materials, including silicon, sapphire, SiC and other non-metal alloys. They feature a beveled tip geometry to facilitate grinding which can be quickly reshaped to extend tool life.

• Metal bond for general use and long life
• Resin bond for brittle materials (SiC) and improved finish

Plated diamond tools are available in a fine and coarse grade and are used for higher removal rate than bonded diamond tools and result in a rougher finish that may require cleanup operations using a bonded tool before polishing. They are an excellent choice for rapid removal of high glass content FR4 substrates.

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