Cold mounting is recommended when encapsulating samples that cannot withstand the heat and pressure of compression mounting, when better flow and penetration of the mounting resin is needed, or when a large quantity of samples must be encapsulated at once.

Acrylics: Typically used for their rapid cure times, or when large volume sample throughput is needed.

QuickCure: When cured under pressure (>20 psi), it produces a clear, bubblefree mount. The longer cure time (15–20 min.) allows improved flow and penetration.

QuickSet: Used to encapsulate a wide variety of specimens, especially PCB coupons and other electronic components. Its rapid, 6–8 minute cure time is ideal for high-volume applications. Pressurization can help to minimize bubbles for improved clarity

Epoxies: Typically used for excellent flow and penetration, or when better adhesion, chemical resistance, less shrinkage and clarity are required.

EpoxySet: With very low viscosity, EpoxySet offers excellent flow and penetration. It is extremely hard, crystal clear and exhibits firm adhesion with virtually no shrinkage. Its low curing temperature is ideal for heat sensitive samples.

EpoxyMount: This fast-curing epoxy hardens in 2 hours at room temperature while still maintaining quality characteristics such as good adhesion, hardness and minimal shrinkage.

Note: Shipping restrictions apply to some of these products and are considered "DG" by IATA and US DOT, additional charges may apply/be incurred.

Release sprays, powder, and liquid prevent hot or cold mounting materials from adhering to the mold/cup.

These 2-part, low viscosity epoxy resins are engineered for specialized bonding applications, featuring excellent adhesion, chemical resistance and thermal/electrical resistance.

EpoxyBond 110™, is rapid curing and heat-activated, ideal in applications where a thin bond line is desired. It has a high transition temperature and extraordinary resistance to post cure, high heat exposure.

EpoxyBond 14™, is clear, colorless and cures very hard either at 65° C in 1 hour or in 24 hours at room temperature. It is ideal for filling small cavities (pocket, underfill) and for glass slide bonding.

M-Bond 610, is excellent for adhering multiple samples for TEM dimpling and bonding of post-polished samples to grids for TEM and FIB observation. It is chemically resistant and provides a very thin glue line that ion mills evenly.

LOCTITES: These high purity adhesives cure rapidly without heat. LOCTITE® 460™ is a low-viscosity liquid and LOCTITE® 454™ is a gel for more controlled application.

Mounting Wax, is a clear wax provides a quick and strong bond between samples and fixtures for cutting and/or polishing. It melts at 49° C (120° F) and is soluble in acetone. Sheet wax provides uniform distribution of wax to improve registration accuracy of the sample to the fixture (i.e., dicing applications). It flows at 100° C (212° F) and is soluble in sheet wax dissolver.