Cold mounting is recommended when encapsulating samples that cannot withstand the heat and pressure of compression mounting, when better flow and penetration of the mounting resin is needed, or when a large quantity of samples must be encapsulated at once.

Acrylics: Typically used for their rapid cure times, or when large volume sample throughput is needed.

QuickCure: When cured under pressure (>20 psi), it produces a clear, bubblefree mount. The longer cure time (15–20 min.) allows improved flow and penetration.

QuickSet: Used to encapsulate a wide variety of specimens, especially PCB coupons and other electronic components. Its rapid, 6–8 minute cure time is ideal for high-volume applications. Pressurization can help to minimize bubbles for improved clarity

Epoxies: Typically used for excellent flow and penetration, or when better adhesion, chemical resistance, less shrinkage and clarity are required.

EpoxySet: With very low viscosity, EpoxySet offers excellent flow and penetration. It is extremely hard, crystal clear and exhibits firm adhesion with virtually no shrinkage. Its low curing temperature is ideal for heat sensitive samples.

EpoxyMount: This fast-curing epoxy hardens in 2 hours at room temperature while still maintaining quality characteristics such as good adhesion, hardness and minimal shrinkage.

Note: Shipping restrictions apply to some of these products and are considered "DG" by IATA and US DOT, additional charges may apply/be incurred.