Products tagged with 'cold mounting'

Release sprays, powder, and liquid prevent hot or cold mounting materials from adhering to the mold/cup.

Cold mounting is recommended when encapsulating samples that cannot withstand the heat and pressure of compression mounting, when better flow and penetration of the mounting resin is needed, or when a large quantity of samples must be encapsulated at once.

Acrylics: Typically used for their rapid cure times, or when large volume sample throughput is needed.

QuickCure: When cured under pressure (>20 psi), it produces a clear, bubblefree mount. The longer cure time (15–20 min.) allows improved flow and penetration.

QuickSet: Used to encapsulate a wide variety of specimens, especially PCB coupons and other electronic components. Its rapid, 6–8 minute cure time is ideal for high-volume applications. Pressurization can help to minimize bubbles for improved clarity

Epoxies: Typically used for excellent flow and penetration, or when better adhesion, chemical resistance, less shrinkage and clarity are required.

EpoxySet: With very low viscosity, EpoxySet offers excellent flow and penetration. It is extremely hard, crystal clear and exhibits firm adhesion with virtually no shrinkage. Its low curing temperature is ideal for heat sensitive samples.

EpoxyMount: This fast-curing epoxy hardens in 2 hours at room temperature while still maintaining quality characteristics such as good adhesion, hardness and minimal shrinkage.

Note: Shipping restrictions apply to some of these products and are considered "DG" by IATA and US DOT, additional charges may apply/be incurred.

The VacuPrep™ removes trapped air from uncured epoxy, filling open pores and cavities in samples to provide maximum bonding and support. This maintains sample integrity during abrasive preparation, reducing the chance of cracking or delamination.

The VacuPrep™ comes in two (2) versions - the standard model and a turntable model.   This new variant adds a turntable with an anti-stick PTFE lined interior that operates with a rotation wheel located on the exterior right side of the unit. The turntable features markings where cups can be positioned beneath the fill tube in the cover. The operator then rotates the wheel on the right side of the unit to position each cup for drawing epoxy from the mixing cup while under vacuum.

The PC-200™ is a large volume pressure chamber for cold mounting with acrylic and epoxy. With an 8" opening and 7.5" depth, this pressure chamber accommodates oversized silicone mounting cups, a large quantity of round cups, or multiple PCB molds.

The process of loading the PC-200™ pressure chamber with freshly poured molds is made easier with the stacking tray. The diameter of the tray easily fits into the chamber opening. The bottom of the tray is Teflon® for easy cleanup of spilled mold resin (acrylic or epoxy). The design allows for stable stacking of three (3) trays into the PC-200.