Cold mounting is recommended when encapsulating samples that cannot withstand the heat and pressure of compression mounting, when better flow and penetration of the mounting resin is needed, or when a large quantity of samples must be encapsulated at once.

Acrylics: Typically used for their rapid cure times, or when large volume sample throughput is needed.

QuickCure: When cured under pressure (>20 psi), it produces a clear, bubblefree mount. The longer cure time (15–20 min.) allows improved flow and penetration.

QuickSet: Used to encapsulate a wide variety of specimens, especially PCB coupons and other electronic components. Its rapid, 6–8 minute cure time is ideal for high-volume applications. Pressurization can help to minimize bubbles for improved clarity

Epoxies: Typically used for excellent flow and penetration, or when better adhesion, chemical resistance, less shrinkage and clarity are required.

EpoxySet: With very low viscosity, EpoxySet offers excellent flow and penetration. It is extremely hard, crystal clear and exhibits firm adhesion with virtually no shrinkage. Its low curing temperature is ideal for heat sensitive samples.

EpoxyMount: This fast-curing epoxy hardens in 2 hours at room temperature while still maintaining quality characteristics such as good adhesion, hardness and minimal shrinkage.

Note: Shipping restrictions apply to some of these products and are considered "DG" by IATA and US DOT, additional charges may apply/be incurred.

2-part cups are reusable and have a separate bottom allowing easy mount removal after curing. Metric size cups are transparent, and compatible with UV light curing resins.

Silicone mold cups are compatible with epoxy or acrylic mounting resins. These reusable cups are available in a range of variable shapes to accommodate larger samples and are 1” deep with thick walls for maximum durability, shape retention and heat dissipation.

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Ultrasonic cleaning is a very effective method for removing debris and dirt from samples prior to mounting and/or during grinding steps and post-polishing to help prevent contamination and scratches.

A variety of models with different options, such as a timer (digital or mechanical) and/or heater are available. 

Accessories such as beaker lids, baskets, etc. are also available in the accessories page. 

The MetPrep 4x™ grinding and polishing machines, with the PH™ line of power heads, are powerful systems for semiautomatic operation, ideal for low to high volume sample preparation requirements. Two combinations provide ideal solutions that accommodate any lab, application or material.

The microprocessor-based system allows the operator to use either the manual Input Mode to enter parameters throughout a procedure, or the user-defined preprogrammed Steps and Sequences Mode to select steps in a sequence as the procedure advances.

The PH-4™ power head offers maximum versatility for low to high volume semi-automatic sample preparation, using either central or individual sample force modes. The pneumatic-electric systems provide controlled sample force and allow up to twelve (12) samples to be prepared simultaneously in central force and four (4) samples in individual force. The unique tilt-up design allows easy, unhindered access to the sample holder and platen, and eliminates the need to reposition the head during the preparation procedure.

Either standard or magnetic platens may be used with any plain/adhesive backed or magnetic system disc.