Products tagged with 'm bond'

These 2-part, low viscosity epoxy resins are engineered for specialized bonding applications, featuring excellent adhesion, chemical resistance and thermal/electrical resistance.

EpoxyBond 110™, is rapid curing and heat-activated, ideal in applications where a thin bond line is desired. It has a high transition temperature and extraordinary resistance to post cure, high heat exposure.

EpoxyBond 14™, is clear, colorless and cures very hard either at 65° C in 1 hour or in 24 hours at room temperature. It is ideal for filling small cavities (pocket, underfill) and for glass slide bonding.

M-Bond 610, is excellent for adhering multiple samples for TEM dimpling and bonding of post-polished samples to grids for TEM and FIB observation. It is chemically resistant and provides a very thin glue line that ion mills evenly.

LOCTITES: These high purity adhesives cure rapidly without heat. LOCTITE® 460™ is a low-viscosity liquid and LOCTITE® 454™ is a gel for more controlled application.

Mounting Wax, is a clear wax provides a quick and strong bond between samples and fixtures for cutting and/or polishing. It melts at 49° C (120° F) and is soluble in acetone. Sheet wax provides uniform distribution of wax to improve registration accuracy of the sample to the fixture (i.e., dicing applications). It flows at 100° C (212° F) and is soluble in sheet wax dissolver.